Capability Matrix

Specifications Standard Technology Advanced Technology
Number of Layer Rigid 20L 48L
Number of Layer Flexible 8L 14L
Number of Layer Rigid Flex 12L 20L
Raw Material FR-4 KB, ITEQ, Shanghai-Nanya, Ventec Rogers, Megatron, Arlon, Dupont/td>
Maximum PCB Size 425x580 mm 435x600 mm
Minimum PCB Thickness 0.25 mm 0.20 mm
Maximum PCB Thickness 5.00 mm 6.5 mm
Minim Drill Dia 0.15 mm (Mechanical) 0.1mm (Laser)
Copper Thickness 35-105 Microns 105-245 Microns
Dril Aspect Ratio 10:1 15:1
Solder Mask Color Green, White, Red, Blue Yellow, Orange, Purple
Legend Marking Color White, Black Orange, Brown, Red
Minimum Trace Width 3 Mil 2.5 Mil
Minimum Spacing 3 Mil 2.5 Mil
Surface Finish HASL, LF-HASL, ENIG, OSP Immersion Silver, Immersion Tin, Selective Gold, Hard Gold.
Quality Standard IPC 6012 Class 2, IPC 6013 Class 2, MIL Group A & Group B IPC 6012 Class 2, IPC 6013 Class 2, MIL Group A & Group B